After passing the WAT (Wafer Acceptance Test) in the front-end wafer foundry FAB. How to handle the wafer thinning and backside metallization (BGBM) before assembly?
Finally wafer thinning and backside metallization (BGBM) were finished, but you need to transport wafer to another suppliers for CP and sawing with high risk, is there any place to do it right one time?
Sputtering Deposition V.S. Electro-less Plating: Two Options for MOSFET FSMQuick Quiz for MOSFET Wafer Thinning Process
Fab Discovery-How to Make a Flimsy Wafer? The Taiko Grinding ProcessHow to Quickly Reduce MOSFET RDS(on) Without Changing Your DesignNew Challenge in 1.5 Mil Taiko Wafer with High Wafer Strength
iST has recruited professional experts and implement advanced processing to assist you in completing wafer thinning and backside metallization (BGBM) in short time.
- Various solutions for surface roughening process
- Various solutions for backside metallization
- Backside silver thickness up to 15um and various solutions for front-side metallization
- A complete and extensive one-stop service
Semiconductor Manufacturing Process
iST is capable to provide one-stop MOSFET backend solution including WLCSP, CP and DPS in cooperation with its subsidiary, ITS (see the blue and pink highlight for iST& ITS services).