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MOSFET / IGBT Wafer Backend Process

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  • Wafer Backend Process
  • Failure Analysis
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MOSFET / IGBT Wafer Backend Process
Sample preparation

Decapsulation/Delayer

SMT Sample Preparation

Cross-section/CP/Grinding

Wafer Saw/COB Bonding

FIB circuit edit
Defect detection
(EMMI/InGaAs/OBIRCH /InSb )
Electrical characteristics measurement(TDR/Curve Tracer/NanoProbe/TLP)
Physical analysis(SEM)
Non-Destructive Analysis (OM/SAT)
Competitive analysis
Non-Destructive Analysis (X-Ray/3D X-Ray)

Inquiry for IC related & Uncertain cases: +886-3-5799909#8585

Wafer Reliability
Component Reliability

Reflow/Thermal Shock/MSL

EMC(EMI. EMS) 

OLT/HTOL

ESD/Latch up

Board Level Reliability (BLR)
System reliability analysis
  • Please contact DEKRA iST
  • Tel: +886-3-5795766
PCB Design &  Verification
Automotive Electronics
Signal Integrity

HDMI/DP/USB

Design Quality Management (DQM)
Chemical Analysis
Consulting Services
Sample Preparation &Structure Observation

DualBeam FIB/Plasma FIB

TEM/EDX/EELS

Surface & Component Analysis

FTIR/TMA/TGA/DSC

CAFM/AFM/SCM/WLI(OP)

XPS/AES/SIMS

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