iST can not only provide original cross-section, but also offer IC backside polishing. From the chip backside, grind the substrate to a specified thickness before performing polishing. The main purpose is to enable the following analysis.

Basic process flow of sample cross-sectioning

• Cutting：Cut sample into proper sizes using a cutter
• Cold fill：Fill mix glue into gaps of sample to enhance structural strength of the sample, so that it is not damaged by the grinding stress
• Grinding：Grind the sample with different sand paper (or diamond sandpaper)
• Polish：Polish with a turntable added with proper polishing liquid to eliminate fine scratches resulting from grinding.