The Superiority of iST
Contact Window | Mr. Lin/Zhaofu | Tel:+886-3-5799909#6631 | Email:web_pfa@istgroup.com
iST can not only provide original cross-section, but also offer IC backside polishing. From the chip backside, grind the substrate to a specified thickness before performing polishing. The main purpose is to enable the following analysis.
Market-leading multi-layer chip stacking and scooping technique: 3D IC process sampling
High success rate
Fast delivery
Contact Window | Mr. Lin/Zhaofu | Tel:+886-3-5799909#6631 | Email:web_pfa@istgroup.com