The Superiority of iST
Contact Window | Mr. Lin/Afu | Tel:+886-3-5799909#6631 | Email:web_pfa@istgroup.com
This is a quick sample preparation method which comes up with clear sample surface by local grinding with sandpaper (or diamond sandpaper) or grinding head followed by polishing.
iST can not only provide original cross-section, but also offer IC backside polishing. From the chip backside, grind the substrate to a specified thickness before performing polishing. The main purpose is to enable the following analysis.
Market-leading multi-layer chip stacking and scooping technique: 3D IC process sampling
High success rate
Fast delivery
Contact Window | Mr. Lin/Afu | Tel:+886-3-5799909#6631 | Email:web_pfa@istgroup.com