The Optical Beam Induced Resistance Change (OBIRCH) scans an IC surface (either front or back) with a laser beam during the IC function test period. OBIRCH employs a laser beam to scan IC internal connection locations to generate a temperature gradient which then leads to resistance variance. It then identifies IC flaws by matching resistance variances.
What iST can do for you?
OBIRCH is normally used for high and low resistance analyses inside the chip, and current leak analysis of a circuit. OBIRCH enables effective locating of circuit defects such as cavities in metal wires, cavities under vias, high-resistance area at bottom of vias, etc., and detects short or current leak successfully as well.
The Superiority of iST
Case Sharing
IC Front-side OBIRCH hot spot
IC Back-side OBIRCH hot spot
- Metal/ Poly/ Well short
- Gate oxide pin hole
- Metal via hole/ Contact resistance failed
- Any IC failure (short/ bridge/ leakage/ high resistance associated with a differential material or its thickness.
Products with unstable output current are not suitable for OBIRCH detection.
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