The Steady-State Test is designed to verify and assess resistance of packaging material and internal circuits of non-sealed packaging electronic components under conditions of accelerated high temperature and moisture. Solder joints of board-level components may suffer metal dissociation due to temperature, moisture and bias which, in turn, may shorten service life due to short circuit caused by metal deposits and dendrite pile-up.
What can iST do for you?
The steady test takes a longer time to execute. iST has large capacity of SST chambers in Asia and online monitoring channels to help you get these tests done successfully.
Reference Specification
- JESD22-A101
- Consumer IC board level