PCBs employed by base station-relevant communication equipment and cloud servers have to be of high frequency material featuring a low dielectric constant and dissipation factor to meet the requirements of high frequency and high speed mandated by 4G/5G and the IoT. There is one problem. The resin and fiber glass contained in specially designed dielectric materials suffer weak bonding strength which may lead to risks of pad cratering.
What can iST do for you
iST provides a comprehensive pad cratering platform service, utilizing the Cold Ball Pull (CBP) test. This service assists clients in evaluating the reliability and lifecycle of high-frequency PCBs, as well as assessing the performance of PCB materials under various process conditions.
The Superiority of iST
Case Sharing
Plant solder ball at top pad
Pull up solder ball with CBP test
Determine failure mode with 3D OM. This photo shows fiber exposure due to pad cratering.
- Cold Ball Pull Test(CBP Test):
The CBP test determines the strength of high frequency and high speed and ordinary materials, as well as assessing the performance of individual materials under different process settings (IPC-9708) by detecting cracks in PCB materials in PCBs due to mechanical stress or broken surface beneath the pad with mounted components.
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