The Package Assembly Integrity Test is a key test in automotive electronics reliability verification which covers Wire Bond Shear (WBS), Wire Bond Pull (WBP), Solderability (SD), Physical Dimensions (PD), and Solder Ball Shear (SBS), Lead Integrity (LI) according to specifications set by the Automotive Electronics Council (AEC). These verifications are required at automotive electronics IC packaging stage to enter any automotive electronics supply chain.
Case Sharing
TDDB Solder Ball Shear (SBS)
Solderability (SD)
Reference Specification
- JESD22-B100
- JESD22-B105
- JESD22-B108
- AEC-Q100 /AEC-Q104
- MIL-STD-883 Method 2011
- Automotive electronics