Scanning Acoustic Tomography (SAT), is an analyzed tool to analyze the material interface quality or behavior by means of different material characteristics in reflection speed and energy from ultrasound signals transmission. When contacting the bonding interface of different materials, part of the ultrasound signals will reflect back to the detector and part of the ultrasound signals will penetrate the bonding interface. When contacting air (voids), 100% of signals will be reflected to the detector to form the image with arrowed areas
When sound signals are transmitted, using pure water as the medium, and hit the interface of different materials, part of the signals reflects and part penetrates. The machine then collects the signals and forms them into images.
IC Repackage Ease-up Inspection Over Advanced Chip PackagingWhat iST can do for you?
Ultrasonic SAT is designed to detect flaws in IC molding including delamination, cracks, voids and bonding status at different locations.
The Superiority of iST
Case Sharing
C-scan (2D reflective plane detection)
Through-scan detection
RDL delamination of WLCSP packaging
PCB blank board inspection – boardpopcorn effect
CMOS-Dam delamination
Chip Crack
C-scan (2D reflective plane detection)
Through-scan detection
Non-flow underfill delamination of flip chippackaging
C-scan 2D reflective plane detection
(Color Mode)
C-scan 2D reflective plane detection
(Colorless Mode)
Through-scan detection
Different probe heads are used for different samples
- 15 Mhz – DIP , PLCC , TO, QFP
- 25 Mhz – DIP , PLCC , TO, QFP
- 30 Mhz – BGA , SOP8 , QFP , SOT223 , TO252
- 35 Mhz – BGA , SOP8 , QFP , SOT223 , TO252
- 50 Mhz – QFN , TQFP, DFN, BGA
- 75 Mhz – TSSOP , Flash
- 100 Mhz – Wafer , Flip Chip
- 110 Mhz – Wafer , Flip Chip
- 120 Mhz – Wafer , Flip Chip , WLCSP
- 180 Mhz – Wafer , Flip Chip , WLCSP
- 230 Mhz – WLCSP , 3D IC
- UHF – CMOS , WLCSP
SONOSCAN GEN 6
SONIX ECHO-VS
SONIX UHR-2001
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