IC devices packaged without desiccants will absorb moisture. During assembly solder reflow at a high temperature, moisture within devices will inflate to cause the cracks on component fragile parts. Using temperature and relative humidity as test conditions, IC devices weight gain/loss analysis assists manufacturers to estimate the lifespan of IC devices and moisture-eliminated baking time.
What can iST do for you?
With the more various developments of packaging assembly and materials, the more different thermal expansion coefficients of component materials. iST provides weight gain/loss method to analyze the influence caused by temperature and humidity to IC. This test minimizes the risk of IC during the assembly solder reflow.
Test Flow
Test Condition
According to IPC/JEDEC J-STD-020, temperature and humidity conditions are divided into three levels. Based on these 3 levels, IC devicesin different absorption levels are baked and put into a moisture container to formulate an absorption curve at each read point, and then be baked again until all moisture lost to have a desorption curve.
| Level | Temperature(°C) | Humidity (%) | Time (Hour) |
|---|---|---|---|
| I | 85 | 85 | 168+5/-0 |
| II | 85 | 60 | 168+5/-0 |
| III | 30 | 60 | 192+5/-0 |