IC devices packaged without desiccants will absorb moisture. During assembly solder reflow at a high temperature, moisture within devices will inflate to cause the cracks on component fragile parts. Using temperature and relative humidity as test conditions, IC devices weight gain/loss analysis assists manufacturers to estimate the lifespan of IC devices and moisture-eliminated baking time.
According to IPC/JEDEC J-STD-020, temperature and humidity conditions are divided into three levels. Based on these 3 levels, IC devicesin different absorption levels are baked and put into a moisture container to formulate an absorption curve at each read point, and then be baked again until all moisture lost to have a desorption curve.
|Level||Temperature(°C)||Humidity (%)||Time (Hour)|