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Finding advanced packaging joint defects after failing the board level reliability test
2022-06-28

When the board level reliability test fails and you are asked to debug,how to quickly find the location of advanced packaging joint defect in 3 steps?…

Improvement of Advanced Process Defect through Materials Analysis
2022-05-26

While process equipment is the key to semiconductor yield, how to improve advanced process defects through materials analysis?…

PCB design:Key to pass or fail in board level reliability tests
2022-05-03

Do you know that PCB design is the key to pass or fail in broad level reliability tests?

How to interpret MTTF?
2022-04-26

How to interpret and use the values from HTOL and the resulting MTTF and Failure Rate (λ)? What are the differences between MTTF and MTBF?

How to find the SiP/ MCM Defects
2022-04-11

How to find suspected defects from complicated MCP/SiP structure? How to isolate interference from other chips/dies and get correct testing results?

Improved delayering techniques for better fault isolation efficiency of advanced process chip
2022-03-24

As an extension of grinding delayer, PFIB can perform large area and excellent uniformity delayering of a specific area or layer through plasma etching with the manufacturer’s patented gas to fully present the target area of up to 200μm x 200μm …