Use various processes such as adhesive, thermal, compression or ultrasonic to bond the dies or components on the specified materials for subsequent wire bonding or function test.
What iST Can Do for You
The die bonding service iST provides including, die sorting, adhesive die bonding, flip chip bonding and eutectic die bonding, etc..
The Superiority of iST
iST offers packaging process such as, die sawing, die bonding and wire bonding, following up with one-stop solution of high quality verification and analyses to effectively shorten the sample preparation time.
Case Sharing
Adhesive dispensing
Die bonding completed
Thermocompression die bonding
Stud bump
Ultrasonic die bonding for stud bump
Gel-pak
Waffle pack
Wafer frame
Die flip
- Wafer frame pick up and place waffle pack sorting
- Wafer frame pick up and place wafer frame
- Wafer map die sorting
- Die flip sorting
- Adhesive dispensing and die bonding
- Thermocompression die bonding
- High precision die bonding process
- Flip chip die bonding
- Eutectic die bonding
- Semiconductor industry
- LED industry
- Optoelectronics industry
- MEMS industry
Tresky T-8000
| XYZ axis placement accuracy | ±5μm @ 3Sigma |
| Die size range(mm) | 0.8~35 |
| Bond force range(g) | 20~2500 |
| Heading plate max. temp (℃) | 350 |
| Bond head heading max. temp(℃) | 350 |
| Flip station max. die size(mm) | 0.8~15 |
| Gel-packs(inch) | 2、4 |
| Waffle pack(inch) | 2、4 |
| Wafer ring size(inch) | 4、6、8 |
| Wafer frame(inch) | 6、8、12 |
Contact Window | Mr. Yang/Benson | Tel:+886-3-5799909#6862 | Email: eb_ass@istgroup.com