Bending test, either in monotonic or cyclic mode, is aimed at identifying bending degree and load strength of devices’ solder joints and material structure under external bending force.
The cyclic bending test is aimed at verifying the fatigue resistance strength of product: repeated pushing and pulling actions may cause the solder balls to break. The broken area and size may be measured by dye and pry or cross-section analysis.
- JESD 22-B113
- IPC 9702
- Board Level relative