Bending test, either in monotonic or cyclic mode, is aimed at identifying bending degree and load strength of devices’ solder joints and material structure under external bending force.
What does BLR means for IC Design Engineers?
Failure Mode
The cyclic bending test is aimed at verifying the fatigue resistance strength of product: repeated pushing and pulling actions may cause the solder balls to break. The broken area and size may be measured by dye and pry or cross-section analysis.
Reference Specification
- JESD 22-B113
- IPC 9702
- EIAJ-4702
INSTRON 5565
- Board Level relative