IC failure analysis may require looking into chips, wires, and devices which do not allow for observation of their internal parts because of the package covering outside. The external layers blocking observation may be removed by “dry etching” and “wet etching” to uncover the devices packaged inside for treatment and observation during testing.
The superiority of iST
In spite of there being scores of packaging types, iST has adequate experience in dealing with any one of them.
Gallium arsenide IC
Special decap is designed to ease the sample for later experiment which comes not only with chemical etching but also physical external forces.
Backside(keep the down bond)
Packaging material preparation
Various kinds of packaging removal
Before crater test
After crater test
Before solder oil / stain removal
After solder oil / stain removal
Before photo resistance removal
After photo resistance removal
Before pin cleaning
After pin cleaning
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