Device manufacturers often find it hard to determine whether customer’s complaints on IC packaging are caused by poor soldering process at the finished goods assembly or poor quality of BGA solder ball. Therefore, it is good to run a solder ball test over BGA/WLCSP packaged ICs before shipment to verify the solderability of solder balls.
What iST can do for you?
iST may provide the same flux and reflow conditions employed by the customer end production line to test solderability of BGA solder balls with simulated process. This not only assesses BGA wetting quality accurately but also reveals quickly failure conditions of defected devices so that defects can be remedied in time.
Failure Mode
3D OM image of BGA solder non-wetting
X-Ray image of BGA solder non-wetting
The Superiority of iST
iST now offers printed circuit plates of various sizes for the BGA solderability tests together with provision of different carrier plates or ceramic plates to deliver optimal services to minimize nuisances in test material preparation.
Reference Specification
- MIL-STD
- IPC J-STD-002