Dice or groove wafer or device to enable later processes or function tests.
What iST can do for you?
iST provides wafer dicing services. This facing dual spindle dicing function not only gives quality dicing for both front and back sides but also offers high-quality dicing service with extra atomizing nozzle two-phase mixture fluid washing for CMOS sensors and other devices which mandate greater cleanness.
The Superiority of iST
In addition to internal dicing machine for wafer of size up to 12", iST provides one-stop high-quality solutions from sample dicing, wire bonding, ceramic packaging, to COB packaging. All these are designed to cut test sample preparation time effectively.
Case Sharing
- Ordinary wafer dicing
- Multi-chip wafer dicing
- Shared chip re-dicing
- Substrate dicing (with or without adhesive)
- Ceramic/glass board dicing
- IPD dicing
Contact Window | Mr. Yang/Benson | Tel:+886-3-5799909#6862 | Email: web_ass@istgroup.com