Various temperature conditions can expose product vulnerabilities, leading to damage or failure and compromising reliability. Thermal cycling and shock testing simulate extreme temperature variations to identify issues like cracking, deformation, or material fatigue. Widely applied in aerospace, electronics, and automotive industries, these tests ensure components withstand operational stresses and maintain durability throughout their life cycle.
Thermal Cycling Testing vs. Thermal Shock Testing
This table summarizes the differences between Thermal Shock and Thermal Cycling Testing.
Aspect | Thermal Cycling Testing (TCT) | Thermal Shock Testing (TST) |
Purpose | Identifies failures due to mismatches in the coefficient of thermal expansion (CTE) between materials and tests a device's ability to endure repeated extreme temperature changes. | Determine the resistance of a part to sudden exposure to extreme changes in temperature and to the effect of alternate exposures to these extremes. |
Test Environment | Single chamber where temperature shifts between high and low extremes. | Multiple chambers (hot and cold) or rapid transition setups, including air-to-air or liquid-to-liquid. |
Failure Mechanisms Detected | - Solder joint cracking | - Wire breaks |
- Lead/terminal damages | - Wire bond lifting | |
- Hermetic seal failures | - Flip-chip bump failures | |
- Delaminations in PCBs | - Die cracking | |
- BGA interconnect defects | - Package cracking | |
Inspection and Testing | Detects long-term reliability issues due to Temperature cycling. | Post-test includes visual inspection and electrical testing for overstress failures. |
Rate of Temperature Change | Gradual, over a longer period. | Immediate, within seconds. |
Typical Failure Types | - Shear creep fatigue | - Tensile overstressed |
- Stress relaxation | - Tensile fatigue | |
Reference Specification |
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