Various temperature environment conditions may expose product vulnerability in its life cycle and lead to product damage or failure which, in turn, may hamper product reliability.
What does BLR means for IC Design Engineers?What can iST do for you?
- Thermal Cycling: apply series of temperature high-low cycling test at change rate of 5 to 15 degrees every minute
- Thermal Shock: apply extremely high and low temperature conditions to DUTs at change rate of 40 degrees every minute (or customer given conditions) for test
This test does not mimic actual environment construction. Instead, it is applying harsh stress and accelerated aging factors to DUTs to identify potential causes which may lead to system equipment and components failure to validate product design or manufacturing.
Normal Failure mode
- Solder cracks due to big difference in material expansion coefficient
- Resistance value errors
The Superiority of iST
- Large capacity of thermal cycling chambers in Asia
- Provide customers up to 20,000 channels for online monitoring
Reference Specification
- JESD 22-A104
- IPC 9701
Temperature cyclic Chamber
- Consumer IC/automotive board level