The IC test, either the pre-dicing wafer test or the post-packaging functional electronic characteristics one, is aimed at eliminating flawed products and improving yields, which is critical in IC production. The reliability verification before shipment is designed to ensure service life projections during practical operation with accelerated stress tests and remove poor processing or early-failing goods with short-time high-temperature burning test to minimize extra return cost. To provide the required conditions and test environment a test interface planning is necessary before each test stage.
iST service strength
iST in-house made burn-in board
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