Products suffering external vibration may lead to two types of error. One is board level solder ball breaking due to fatigue by repeated vibration stress during transportation or field operation. The other is severe structure damage caused by resonance amplification triggered by vibration stress as a result of fixation method or structural design natural frequency.
What does BLR means for IC Design Engineers?Failure Mode
Reference Specification
- JESD 22-B103
- MIL-STD 883 method 2007
- ASTM D4169
- Consumer IC
- Automotive board level
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