IC devices are required to be lighter, thinner, more compact and smaller, such that more I/Os can be crammed into ever more miniaturized space of grains. All these lead to worsening EMI (Electromagnetic Disturbance) and EMS (Electromagnetic Sensibility)
The EMC (EMC=EMI+EMS) problems caused by ICs will be harder to solve if they are tackled at the end of product design phase rather than from the beginning. Therefore, early in the IC design stage, IC EMC status should be learnt and EMI control measures should be taken to reduce substantially both EMI and product modification costs.
New Package New Challenges, Solutions for Two Issues of Automotive Electronics Reliability TestingWhat iST can do for you?
- TEM cell test: radiation level of IC noise can be determined and effective IC stability data can be provided for product quality and technical feature control.
- Near field scanner: the distribution of noise strength can be measured by the chip level near field probes with super high spatial resolution and high precision robot arms. It also helps IC and PCB developers in locating EMI sources.
The superiority of iST
iST is capable of providing integrated tests and test results match report according to specification covering the whole process from IC EMl PCB layout and manufacturing to IC EMI measurement and analysis.
Case Sharing
IC EMI test fixture
IC EMI analysis
Reference Specification
TEM cell test (transverse electric mode)
- SAEJ1752/3 (draft by SAE Society of Automotive Engineers)
- IEC61967/2 (International Electrotechnical Commission)
- AEC-Q100 /AEC-Q104 (the US Automotive Electronics Council)
Near field scanner
- SAE-J1752/2
- IEC 61967/3
TEM cell measurement
Near field scanner measurement
- Automotive industry, semiconductor industry, Electrical industry