The superiority of iST
iST offers sample dicing, wire bonding, ceramic or COB assembly followed by premium one-stop solution services for ESD/OLT analysis and verification to minimize test sample preparation time significantly.
Case Sharing
- PCB development and packaging projects
- Rework of rejected ICs sample preparation, backside sample preparation
- Planning of small-quantity production
- Wire bonding/molding/capping
- Varieties of wire bonding methods: driver IC, COB, FIB Pad, chip-to-chip, ball mounting
- Wire bonding verification(Open/Short test)
Contact Window | Mr. Yang/Benson | Tel:+886-3-5799909#6862 | Email: web_ass@istgroup.com