For product failure in series of reliability verification over devices mounted board, the BLR integrated failure analysis may identify interface defects, drill down to its causes and modify the board for another verification to get launched on schedule.
What iST can do for you
Positioning and identifying interface failure with BLR integrated failure analysis:
- X-ray inspection (2D & 3D X-ray): identify interface abnormality after test with non-invasive measures
- Ultrasonic scanning (SAT): identify delamination after BLR test with non-invasive measures
- Thermal EMMI : : positioning defects after test with thermal EMMI
- Identify micro cracks in PCBA with Dye and Pry test
- Cross-section: slice and inspect a given area to identify anomalies
Failure Mode
The Superiority of iST
- Profession and integrated failure consultancy covering causes to anomalies and cross-station analysis and recommendation.
- Fast delivery: multi-shift lab operation