This is a quick sample preparation method which comes up with clear sample surface by local grinding with sandpaper (or diamond sandpaper) or grinding head followed by polishing.
iST can not only provide original cross-section, but also offer IC backside polishing. From the chip backside, grind the substrate to a specified thickness before performing polishing. The main purpose is to enable the following analysis.
Basic process flow of sample cross-sectioning
Cutting:Cut sample into proper sizes using a cutter
Cold fill:Fill mix glue into gaps of sample to enhance structural strength of the sample, so that it is not damaged by the grinding stress
Grinding:Grind the sample with different sand paper (or diamond sandpaper)
Polish:Polish with a turntable added with proper polishing liquid to eliminate fine scratches resulting from grinding.
The Superiority of iST
1
Market-leading multi-layer chip stacking and scooping technique: 3D IC process sampling
2
High success rate
3
Fast delivery
Case Sharing
Cross-section
Backside Polishing
Die Cross-Section
Cu process Cross-section
Bump Cross-section
Backside grinding of general IC
Backside grinding of COB sample
OBIRCH image after backside polishing
Application
IC products, such as Flip Chip, Al/Cu process structure, C-MOS Image Sensor
PCB/PCBA product
LED product
Contact Window | Mr. Lin/Afu | Tel:+886-3-5799909#6631 | Email:web_pfa@istgroup.com