Metallic wires are employed to connect chip and lead frame during IC assembling which may suffer inadequate strength and pollution. This test is aimed at verifying joint force by testing wire bond pull and shear to ensure resistance of packed IC against external stress.
Case Sharing
The Superiority of iST
- Assist customer in making customized fixture and jig
- Assist customer to fulfill urgent orders the same day
Reference Specification
- MIL-STD-883 METHOD 2011.7
- JESD22-B116
- Brand: DAGE
- Model: DAGE 4000
- Specification: shear force up to 100kg and pull 5kg
- IC assemply process