IC failure analysis may require looking into chips, wires, and devices which do not allow for observation of their internal parts because of the package covering outside. The external layers blocking observation may be removed by “dry etching” and “wet etching” to uncover the devices packaged inside for treatment and observation during testing.
What iST can do for you
Based on its long and profound experience, iST is able to provide the optimum decapping method specific to individual packaged IC to prepare for easy testing. See below for some of the techniques we can offer. For more details please call us at your convenience.
Package decap
LED, gallium arsenide IC, automotive IC, optical coupling IC
Special decap
backside, MEMS, packaging material preparation, various kinds of packaging removal
Chemical etching analysis
crater test, solder oil / stain removal, photo resistance removal by chemical etching, pin cleaning
The superiority of iST
Case Sharing
In spite of there being scores of packaging types, iST has adequate experience in dealing with any one of them.
LED
Automotive IC
Gallium arsenide IC
Special decap is designed to ease the sample for later experiment which comes not only with chemical etching but also physical external forces.
Backside(keep the down bond)
Packaging material preparation
MEMS
Various kinds of packaging removal
Before crater test
After crater test
Before solder oil / stain removal
After solder oil / stain removal
Before photo resistance removal
After photo resistance removal
Before pin cleaning
After pin cleaning
Contact Window | Mr. Wu/Puma | Tel:+886-3-5799909#6731 | Email:web_decap@istgroup.com