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Electron Backscatter Diffraction (EBSD)

Electron Backscatter Diffraction (EBSD) is a non-destructive analytical technique commonly used in electron microscopy (EM). When a high-energy electron beam interacts with a sample’s crystal lattice, it produces characteristic Kikuchi patterns. By comparing these patterns with a reference database, researchers can identify various microstructural features of the crystal, including grain size, lattice characteristics, grain boundaries, crystallographic texture, and strain

Crystal Structures in Materials: The Key to Unbeatable Semiconductor Advanced Packaging

  • What iST can do for you?

    EBSD (Electron Backscatter Diffraction) is a powerful technique for studying the microstructure of crystalline materials. By using EBSD, we can help clients analyze critical grain-related properties—such as grain size, morphology, distribution, and orientation—as well as perform crystal phase identification, texture (preferred orientation) analysis, and grain boundary characterization. These insights enable customers to optimize material selection and improve manufacturing processes.

The Superiority of iST

1

Equipped with the industry’s most advanced Oxford Symmetry EBSD detector, we guarantee exceptional analytical quality and outstanding instrument stability.

2

We provide both high-quality results and rapid turnaround times, 24/7.

Case Sharing

  • Grain Analysis of a Hybrid Bonding
  • Lattice Analysis of a TSV
  • Grain analysis of a Copper Pillar
  • Phase Identification, Texture, and Microstructural Characterization of a Cast Iron
  • Lattice and Strain Analysis of a Rolled Aluminum

A hybrid bonding structure undergoes recrystallization during bonding under specific temperature and pressure conditions.

Grain orientation distribution within a TSV of advanced package product

Grain and grain boundary distribution map of a copper pillar

Statistical table of copper pillar grain sizes

Phase distribution map of a copper pillar

Phase identification and distribution in a Cast Iron

Lattice and strain distribution in a rolled aluminum

  • Materials
  • Capability
  • Industries
  • Semiconductors: IC manufacturing process, advanced package
  • Metals & Alloys: copper, iron, aluminum, nickel metals/alloys, etc.
  • Intermetallic Compounds (IMCs): copper-based, nickel-based, titanium-based, etc.
  • Ceramics: ITO, alumina (Al2O3), zirconia (ZrO2), SiC, WC, etc.
  • Thin Films: crystalline coatings
  • Minerals
Oxford Symmetry EBSD Detector
Detection Limitrain size>20nm
High Speed (pps)4500
High Resolution (pixels)1244x1024
High Angular resolution (Deg.)0.05．
  • Semiconductor
  • Metalwork
  • Aerospace: aluminum components, blades, valves, etc.
  • Automotive: blades, valves, etc.
  • Earth Sciences

Contact Window | Dr. Lin, Wei-jui | Tel:+886-3-5799909#6166 | Email: web_ma@istgroup.com

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