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SI/PI Simulation & Design Evaluation

In high-speed signal transmission products, Signal Integrity (SI) and Power Integrity (PI) simulation are crucial for ensuring product competitiveness. With advancements in electronic technology, especially in AI high-bandwidth applications, issues like impedance mismatch, poor structural design, or improper via placement can easily cause signal interference, crosstalk, distortion, and delays, affecting signal quality. As computing speed and density increase, high-frequency switching and large currents can lead to voltage fluctuations and noise, impacting power integrity and overall system performance. Therefore, SI and PI evaluation are essential to ensure system stability during high-speed operations.

iST Launches AI High-Speed Signal Transmission Solution to Help You Lead the Market

  • What can iST do for you

    iST offers Signal Integrity (SI) and Power Integrity (PI) simulation services, where clients simply need to provide circuit diagrams and Gerber files. Using Ansys & Cadence simulation software, iST assists clients in performing front-end design evaluations during the product development stage. Additionally, signal simulations are conducted in the early trial production phase to help clients reduce cost risks caused by design flaws. We provide the following services:

    一、 Signal Integrity (SI)
    • S-Parameter: Return Loss / Insertion Loss / Crosstalk
    • TDR (Time Domain Reflectometry)
    • Eye Diagram Analysis
    二、Power Integrity
    • DC IR-Drop Analysis: Analyze power net voltage drop to ensure it stays within the allowable range, preventing system abnormalities. Testing indicators include voltage drop distribution, current density, DCR, and power loss.
    • AC PDN Analysis : Check the impedance at the device end to maintain low AC impedance. High impedance can cause IC malfunction and power noise, affecting system stability.

The Superiority of iST

1

iST Signal Testing Team offers seamless integration from IC packaging testing to product development and system integration.

2

With expertise in both semiconductor and system manufacturing, our engineering team provides valuable design insights to help clients reduce intangible costs associated with design evaluation.

3

We possess extensive engineering expertise and experience, ranging from the development of Load Boards and Probe Cards needed for IC packaging testing to high-speed signal simulation and evaluation at the system level, offering comprehensive one-stop services.

Case Study

  • DC IR-drop improve
  • AC PDN Improve
  • High-Speed Channel Quality Check
  • High-Speed Channel Quality Check and Improvement
  • Eye Diagram
  • Scope of SI/PI Simulation and Design Services
  • Application
  • DDR SDRAM Design：Evaluate and optimize the signal and power integrity of DDR memory systems.
  • Transceiver (Tx/Rx Interface)：Simulation and optimization for high-speed data transmission interfaces.
  • Board-Level Power Analysis：Optimize power design through simulation to enhance overall system performance.

IC Packaging Test (Probe Card/Load Board) for Consumer Electronics and Server-Related Products

Contact Window|Mr. Chen/David | Tel: +886-2-27922890 #2715 | email: [email protected]

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