3D Optical Microscope (3D OM) captures the reflection of visible light from object surface with optical zoom-in and zoom-out and CCD for surface pattern observation and dimension analysis and measurement.
IC Repackage Ease-up Inspection Over Advanced Chip PackagingWhat iST can do for you?
3D OM has large depth of field, inclinable angle and advanced measuring functions to focus on the device under test of different heights at different angles and obtain clear images for observation. 3D OM is suitable for the inspection and failure analysis of electronic part soldering.
The Superiority of iST
Case Sharing
Through the multiple lighting, the previously unobserved subtle position is identified.
Under a single light source
Use multiple lighting, and change the location of the light sources, the trace becomes obvious.
Render full focus image at high-rate observation.
High-resolution and ultrahigh field depth together and support inclined small-angle 3D observation.
LED transmission lighting equipped on the XY electric stand of the all-angle observation system for detecting clogs in through holes or damage of hole wall of PCBs.
Comprehensive measurement functions, including length, angle, area, and other items, to meet all measurement needs of customers.
Retrieve and compose multiple images with the automatic movement of the XY stand to render wide-angle images.
- Detection of part IC package defects, such as appearance integrity, the black gum cracks, pin deformation or discoloration.
- Detection of potential PCB defects, such as nodules, weave exposure, glass fiber exposure, solder mask, text.
- Detection of potential detects in electronic products, such as poor soldering.
- Solder ball integrity inspection of BGA and flip chip packages, such as ball deformation.
- Appearance check and analysis of active and passive components.
- Analysis and measurement of all materials.
Contact Window | Ms. Chen/Lena | Tel:+886-3-5799909#6570 | Email:web_nde@istgroup.com