Dice or groove wafer or device to enable later processes or function tests.
What iST can do for you?
iST provides wafer dicing services, including Multi Project Wafer (MPW) and versatile solutions for various wafer materials. With a low-temperature Pico laser saw and a fully automated blade dicing saw, we offer multiple cutting options tailored to tackle the specific challenges posed by different materials during the dicing process:
- Blade Dicing (BD)
- Laser Full Cut (FC)
- Laser Grooving + Blade Dicing (LG+BD)
- Blade Dicing + Laser Dicing (BD+LD)
- Laser Grooving + Blade Dicing + Laser Dicing (LG+BD+LD)
The Superiority of iST
In addition to internal dicing machine for wafer of size up to 12″, iST provides one-stop high-quality solutions from sample dicing, wire bonding, ceramic packaging, to COB packaging. All these are designed to cut test sample preparation time effectively.
Case Sharing
Figure 1： Delamination in Low-Dielectric Materials from Blade Dicing
Figure 2： Full-Depth Laser Dicing with No Surface Metal Cracking
- Ordinary wafer dicing
- Multi-chip wafer dicing
- Shared chip re-dicing
- Substrate dicing (with or without adhesive)
- Ceramic/glass board dicing
- IPD dicing
- Multi stacker wafer
- Narrow kerf width
- High density wafer
Contact Window | Mr. Yang/Benson | Tel:+886-3-5799909#6862 | Email: web_ass@istgroup.com