Dice or groove wafer or device to enable later processes or function tests.
The Superiority of iST
In addition to internal dicing machine for wafer of size up to 12″, iST provides one-stop high-quality solutions from sample dicing, wire bonding, ceramic packaging, to COB packaging. All these are designed to cut test sample preparation time effectively.
- Ordinary wafer dicing
- Multi-chip wafer dicing
- Shared chip re-dicing
- Substrate dicing (with or without adhesive)
- Ceramic/glass board dicing
- IPD dicing