The Superiority of iST
iST offers packaging process such as, die sawing, die bonding and wire bonding, following up with one-stop solution of high quality verification and analyses to effectively shorten the sample preparation time.
Case Sharing
- Wafer frame pick up and place waffle pack sorting
- Wafer frame pick up and place wafer frame
- Wafer map die sorting
- Die flip sorting
- Adhesive dispensing and die bonding
- Thermocompression die bonding
- High precision die bonding process
- Flip chip die bonding
- Eutectic die bonding
- Semiconductor industry
- LED industry
- Optoelectronics industry
- MEMS industry
Contact Window | Mr. Yang/Benson | Tel:+886-3-5799909#6862 | Email: eb_ass@istgroup.com