Home Face the Inevitable Test Failure. How to Solve Warpage Problem of Automotive Advanced Packages

Face the Inevitable Test Failure. How to Solve Warpage Problem of Automotive Advanced Packages

Home Face the Inevitable Test Failure. How to Solve Warpage Problem of Automotive Advanced Packages

Face the Inevitable Test Failure. How to Solve Warpage Problem of Automotive Advanced Packages

by ruby

Issued Date: 2019/8/15 Automotive advanced package warpage
Issued By: iST

The conventional packaging is stable and reliable, which was an excellent choice for automotive electronics. However, with booming IoV (Internet of vehicles) market, the advanced packaging chip has been adopted overwhelmingly. But subsequent, how to solve warpage problem of automotive advanced packages?

Get a warm response for the video “New Package New Challenges, Solutions for Two Issues of Automotive Electronics Reliability” iST released last month, we learned that “Thermal Problem” and “EMI” are two major issues to be overcome in the stage of automotive electronic components.

Moving forward, what are the challenges at the board level reliability phase?

In this “iST Video Series”, Mr. Daniel Chuang, manager of component and board level engineering department of iST, with 12 years of experience, is here to share the most frequently encountered issues “warpage” in reliability of automotive electronics and how to deal with it in a video lasting about 4 minutes.

Automotive advanced package warpage

automotive advanced package warpage
automotive advanced package warpage video

To view this video: 1.Click the above picture 2.Hyperlink: https://youtu.be/Z6qu8BwF240 3.Scan QR code

Should there be any automotive-electronics-related requirements, please call Mr. Daniel Chuang at +886-3-579-9909 Ext. 6406 or email: web_BLR@istgroup.com or marketing_tw@istgroup.com