Issued Date: 2019/8/15 Automotive advanced package warpage
Issued By: iST
The conventional packaging is stable and reliable, which was an excellent choice for automotive electronics. However, with booming IoV (Internet of vehicles) market, the advanced packaging chip has been adopted overwhelmingly. But subsequent, how to solve warpage problem of automotive advanced packages?
Get a warm response for the video “New Package New Challenges, Solutions for Two Issues of Automotive Electronics Reliability” iST released last month, we learned that “Thermal Problem” and “EMI” are two major issues to be overcome in the stage of automotive electronic components.
Moving forward, what are the challenges at the board level reliability phase?
In this “iST Video Series”, Mr. Daniel Chuang, manager of component and board level engineering department of iST, with 12 years of experience, is here to share the most frequently encountered issues “warpage” in reliability of automotive electronics and how to deal with it in a video lasting about 4 minutes.
Automotive advanced package warpage
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