Tech Library Archives - iST-Integrated Service Technology

EELS Applications “In our previous article《 EELS: The TEM Tool You Shouldn't Overlook》, we introduced the structure and characteristics of EELS spectra. In this edition of "iST Materials Lecture," we will delve deeper into the applications of EELS in material analysis, helping readers gain a clearer understanding of composition analysis techniques in TEM/STEM.”

2026-06-30by Hsinyi

The Ultimate Lens for Semiconductor Material Analysis! Understanding EELS and its applications

CPO GR468 The inaugural year for the mass production of silicon photonics chips is finally upon us, yet the industry still lacks a universally dedicated standard. Currently, the most authoritative baseline remains Telcordia GR-468—a classic specification introduced over two decades ago. In the face of rapidly evolving silicon photonics and Co-Packaged Optics (CPO) technologies, can this "legacy standard" still shoulder the critical responsibility of reliability verification? Furthermore, how can R&D engineers bridge the standard gap to ensure products successfully pass the bring-up phase and transition into smooth mass production?

2026-06-09by Hsinyi

Can Legacy GR-468 Handle SiPh & CPO?

Failure Mechanism The issue is at the packaging and testing side; it’s not my concern. Why should I care?" This remains a common misconception among IC design engineers when faced with Board Level Reliability (BLR) failures, such as package delamination. While identifying liability is necessary, deeply analyzing the Failure Mechanism is the real key to winning customer trust. In the race toward Zero Defect, the ability to master precisely when and why a product fails—more accurately than the carmakers themselves—is the entry ticket to the global automotive supply chain.

2026-05-12by Hsinyi

Beyond AEC-Q: Why a “Pass” is No Longer Enough

SiPh Failure banner pics

2026-04-14by Hsinyi

Safeguarding High-Value ASICs: Why KGD Verification is the Strategic Key to Unlocking CPO Commercialization

Destructive Physical Analysis It’s a chipmaker’s worst nightmare: Your SoC has survived thousands of hours of reliability stress testing, and the ATE (Automatic Test Equipment) data is flawless. With a "Pass" in hand, the contract seems secure. However, the shock comes during the Tier 1’s IQC (Incoming Quality Control). Despite perfect electrical signatures, the entire batch is rejected due to microscopic solder joint cracks. In an instant, months of R&D effort are wasted, and the Design Win you fought for is in jeopardy. This raises a critical question: If your electrical data is perfect but the structure is failing, how can you truly guarantee Zero Defect?

2026-03-25by Hsinyi

The False Pass Crisis: Why Flawless ATE Data Can Still Lead to Tier 1 Rejections?

Test Vehicle As a Semiconductor Material R&D Engineer, you’ve likely faced this: your material properties are world-class, but in the new arena of 3D/3.5D and multi-die Heterogeneous Integration, your verification data is stuck in the Simulation stage. Without access to a customer’s Dummy Wafer or Test Vehicle (TV), you cannot convince OSATs to initiate mass production. When customers ask, "How does it perform within an actual package structure?" you lack the "system-level" evidence to respond.

2026-03-11by Hsinyi

Winning the Advanced Packaging Race: Turn Lab Data into OSAT-Ready Results

PCR Memory The price of DDR5 memory has surged by over 100%! As HBM production capacity squeezes the market in 2026, the margin for error at testing facilities has vanished. As the unit price of a single memory chip doubles, can your test interface ensure "zero damage," "zero misjudgment," and "zero frequent downtime" to protect your final profits?

2026-02-03by Hsinyi

Chips More Expensive Than Gold? Safeguard Your Yield with Advanced Test Interfaces

High Speed Ethernet 800G As 400G/800G Ethernet transitions from the datasheet to mass production, many R&D teams are facing a frustrating paradox: simulations look perfect, and IC specifications meet the standard, but the final product fails to reach maximum throughput. Is the root cause in the design itself, the physical channel characteristics, or the test condition settings? Why is High-Speed Ethernet so difficult to verify?

2026-01-20by Hsinyi

AI Server Rush: How to Guarantee Your 400G 800G Ethernet Design Success?

SiPh CPO From Electrical Limits to Optical Challenges, Who Will Lead the Next Wave of AI Infrastructure? As global AI leaders double down on next-generation compute, a pivotal question dominates the industry: why has silicon photonics—despite massive investment and engineering talent—still not crossed the threshold into true mass production?

2025-12-15by Hsinyi

Silicon Photonics CPO Nears Mass-Production Breakthrough?

SIPI simulation Your high-speed product runs fast — but does it run stably? In the GHz generation, every trace on your PCB can become a potential failure point. A signal delay of 10-ps or a 1 Ω impedance mismatch can easily derail your product before mass production. With SIPI simulation, hidden electrical risks can be identified early in the design phase — ensuring your product not only works but is ready for volume production.

2025-11-27by Hsinyi

Why SIPI Simulation Is Becoming Essential in High-Speed Product Design

1
2
3
…
15
Next Page »