Board Level test now employ solder for conduction connection which may be replaced by PCB pins, USB ports or other non-solder connection design in future. These tests test the impact of external stress on component joints and repeated use of product over its service life cycle.
Reference Specification
- MIL-STD 883
- MIL-STD 202
- IEC 60068
- JESD22-B105
- EIAJ-4702
- ASTM D903-98
- ASTM D1876
- EIA-364
- SEMI G86-0303
- Consumer IC
- Consumer board level
- Automotive IC