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Surface 3D Profiler

iST’s 3D surface profilometry service is designed to address the limitations of traditional measurement methods, such as low efficiency and operator-induced variability. This non-contact technique enables rapid scanning over large areas, delivering accurate 3D profile measurements.

The core principle involves projecting striped light patterns onto the sample surface. Variations in surface height distort the projected stripes, and by calculating the phase shift based on a known incident angle, the system reconstructs a full 3D topography of the sample.

Yield Problems? Master 3D Surface Topography with 4 Methods

  • What Can iST Do For You?

    iST offers a one-stop 3D surface profilometry solution that supports the entire workflow—from sample preparation, mechanical and environmental stress testing, to abnormality inspection and failure analysis. When anomalies are identified following reliability tests, iST’s Failure Analysis and Material Analysis labs enable quick root cause identification, shortening turnaround time and accelerating problem resolution.

    Equipped with the Keyence VR-6200 3D Profilometer, iST provides high-resolution, automated, and non-contact scanning capable of measuring surface area (X/Y), height (Z), and curvature changes simultaneously. This system requires minimal pre-treatment and is ideal for detecting warpage, expansion, and concavity in packaging, modules, PCBs, and high-step structures.

The Superiority of iST

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1. High-Precision, High-Efficiency 3D Measurement Capability:
Max measurement range for 300 × 150 × 70 mm. Resolution: 0.4 µm (Z), ±5 µm (X/Y). Point data: Up to 25 million points. Compatible with high-reflective, low-reflective, and transparent samples for stable data acquisition.

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2. From Microstructures to Large-Area Components:
Our system captures both overall module geometry and fine structures such as solder balls. One-click non-contact scanning eliminates the need for manual focus and adjustment. Automatic image stitching ensures

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3. Integrated with iST’s One-Stop Analytical Services:
3D profilometry results serve as critical input for iST’s failure and material analysis services, enabling fast anomaly localization and root cause identification.

Case Sharing

  • Image Overlay Analysis
  • Specified Non-Contiguous Area Flatness Analysis

Through the image overlay function, quickly compare the differences between different components in the same area.

In a complex surface, isolate a specified area and analyze its flatness.

  • Equipment Capacity
  • Application

Gatan GIF Model 1065 Continuum ER

Keyence VR-6200
  • Sample Size (mm): 300 x 150 mm
  • Z-axis Accuracy: Without Z stitching: ±2.5 µm/ With Z stitching: ±4.0 µm
  • XY-axis Accuracy: ±5.0 µm ~ ±2.0 µm
  • Z-axis Resolution: 0.1 µm
  • XY-axis Resolution: 1 pixel = 1.9~23.5 µm (depends on magnification)
  • Equipment Limitation: Transparent samples require pre-treatment
  • Wafer
  • Bare die
  • IC chips
  • Capacitor
  • passive components
  • PCB
  • PCBA
  • Connector
  • Socket
  • BGA
  • CSP
  • QFN

Contact Window | Mr. Liu/Hy | Tel:+886-3-5799909#6419 | Email: web_BLR@istgroup.com

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