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Home Production SI/PI Simulation & Design Evaluation

SI/PI Simulation & Design Evaluation

Verification Analysis

FIB Circuit Edit

FIB Introduction and Application

FIB Circuit Edit/ CAD Probe Pad Debug
The Innovative FIB Circuit Edit (N-FIB)
G2 WLCSP circuit edit solution

Engineering Sample Preparation

Quick Assembly

Wafer Dicing Saw
Die Bonding
IC Wire Bonding / Assembly

Surface Mount Technique (SMT)

Surface Mount Technique (SMT)

Failure Analysis

Electrical Characteristics Measurement

I-V Curve Measurement
Auto Curve Tracer (ACT)
Nano Prober
Probe Measurement
TLP measurement of ESD Protection Devices

Non-Destructive Analysis

3D OM
SAT
X-ray Inspection (2D X-ray)
High Resolution 3D X-ray Microscope
Scanning Acoustic Tomography (SAT)

Sample Preparation

IC Decapsulation
IC Delayer
Cross-section & Backside polish
Ion Beam Cross-section Polisher (CP)

Defect Detection

Emission Microscope (EMMI)
InGaAs EMMI
Optical Beam Induced Resistance Change (OBIRCH)
Thermal EMMI (InSb)

Competitive Analysis

IC structure/ Competitive Analysis

Signal Integrity

Signal Integrity Test

HDMI Test / Debug / Certification
HDCP Test ／Debug／Certification
Display Port Test／Debug／Certification
VESA DisplayHDR /
DisplayHDR True Black
Pre-test / Debug / Certification
Special Cable Signal Test
USB Type-C Test / Debug / Certification
VESA AdaptiveSync Display Test / Debug / Certification
VESA ClearMR Test / Debug / Certification

Design Quality Management (DQM)

Compatibility Test
Software Maturity Test

AI High-Speed Signal Solution

PCB Substrate Characteristic Test
PHY Conformance
High-Speed Signal Test Fixture
SI/PI Simulation & Design Evaluation

Others

International Market Access Service

Material Analysis

Sample Preparation

Dual Beam FIB

Structure Observation

Scanning Electron Microscope (SEM)
Dual Beam FIB
Plasma FIB
Transmission Electron Microscopy(TEM)

Surface Analysis

Auger Electron Spectroscopy (AES)
XPS/ESCA
Secondary Ion Mass Spectrometer (SIMS)
X-ray diffraction (XRD)
Atomic Force Microscopy (AFM)
White light interferometry (WLI)
Fourier Transform Infrared Spectroscopy (FTIR)

Thermal Analysis

Dynamic Mechanical Analyzer (DMA)
Differential Scanning Calorimeter (DSC)
Thermogravimetric Analyzer (TGA)
Thermomechanical Analyzer (TMA)

Component Analysis

Scanning Electron Microscope (SEM)
Auger Electron Spectroscopy (AES)
XPS/ESCA
Transmission Electron Microscopy(TEM)
Electron Energy Loss Spectroscopy (EELS)

Crystallographic Analysis

Electron Backscatter Diffraction (EBSD)
X-ray diffraction (XRD)

Reliability Test

Component Reliability Test

Accelerated Environmental Stress Test

MSL Test
Temperature Humidity Test

Accelerated Lifetime Simulation Test

Non-volatile Memory Reliability
Operating Life Test (OLT)
High Temperature Operating Life Test(HTOL)

Package Assembly Integrity Test

Wire Bonding Integrity
Solder Ball Integrity
Package Lead Integrity Test
Package Assembly Integrity Test

Electrical Verification Test

ESD/ EOS / Latch-up Verification
Low Voltage Surge Test
EMC Verification (EMI+EMS)
Conductive Atomic Force Microscopy (C-AFM)

Mechanical stress test

Board Level Reliability Test

Low Strain Rate Test

Thermal Cycling / Shock Test
Monotonic Bending / Cyclic Bending Test

High Strain Rate Test

Mechanical Shock Test
Vibration Test

Steady-State Test
Mechanical Stress tests
BLR Integrated Failure Analysis

PCB Design Verification

PCB Design and Fabrication Service
PCB Reliability Test
Load Board
Probe Cards

SMT Services

Surface Mount Technique (SMT)

Automotive Electronics Test

BLR Verification for Automotive Electronics
Automotive System/PCB Reliability Test
Reliability Test of Automotive IC (AEC-Q)

Warpage Verification

Warpage Measurement

Others

Accelerated Corrosion Verification Platform
PCB Pad Cratering Verification
Trace weight measurement and analysis
Packaged Devices Weight Loss/Gain Analysis

Chemical Analysis

Consultancy for green and environmental protection regulations

Environmental Regulation Test
Chemical Substance Management

Precise and quantitative analysis and unknown substance analysis

Verification of PCB/ PCBA Chemicals
Oil/ Water/ Soil/ Gaseous pollutant Analysis
Micro Pollution (Unknown Material) Test/ Analysis
Reliability Test of Automotive IC (AEC-Q)

Various Consultancy

Quality assurance and function safety consultancy

Total Quality Management Consultancy (IATF 16949)
ISO 26262 Consultancy

ESG consultancy

Value-Added Services for HSE and ESG
Greenhouse Gas/Carbon and Water Footprint Assessment /ISO 50001 Consultancy

Laboratory accreditation and Green Mark consultancy

ISO/IEC 17025 Lab Certification Consultancy
WEEE Environment Protection Logo and EPEAT Consultancy

Others

Hardware Solution

Design And Fabrication

Pressure Conductive Silicone Rubber (PCR)

Simulation Services

SI/PI Simulation & Design Evaluation

MOSFET Wafer Backend Process (BGBM)

MOSFET Front-Side Metallization Process

Chemical / Electro-less Plating
Front-Side Metal Sputtering Deposition

MOSFET Backside Grinding Process

Wafer Thinning / Non-Taiko Grinding/Conventional Grinding (BGBM)

MOSFET Backside Metallization Process

Metal Evaporation Deposition for Backside Metallization
Thick Ag Process

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