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Probe Card

What is a Probe Card and When is it Used?

A probe card is a critical interface tool used during the wafer test (Wafer Sort Test /Chip Probing) stage of semiconductor production. Before the ICs are diced and packaged, precise electrical testing is performed to ensure they meet mass production quality. By using a probe card, each die on the wafer can be accurately connected to the automated test equipment (ATE) for electrical verification. This process effectively screens out defective chips early, stabilizes and streamlines the testing workflow, and ultimately improves packaging efficiency and overall production yield.

  • What can iST do for you

    iST provides full platform compatibility and high-frequency, fine-pitch probe card design. Leveraging experience from iST’s in-house high-speed signal verification, reliability testing, and failure analysis laboratories, we deliver optimized probe card solutions for IC design companies, OSATs, and IDM manufacturers. Depending on chip characteristics and testing requirements, iST offers the following probe card structures and project-based custom designs:

    Probe Card Types and Their Applications

    TypeFeaturesSuitable Applications
    Cantilever

    		Low cost, short lead time, suitable for large padsAnalog ICs, power devices, mature process products
    VerticalSupports fine pitch, high frequency, low crosstalkHigh-density logic chips, SoCs, multi-die testing
    MEMS Probe CardExcellent high-frequency response, high precision, high temperature resistanceAdvanced packaging, 3D ICs, automotive ICs, memory

Advantages of iST Probe Card Design

1

One-Stop Integrated Services: iST is a professional testing laboratory, and every probe card undergoes a rigorous inspection process before shipment, including flying probe testing, electrical testing, and structural verification, ensuring stable quality and high reliability.

2

Comprehensive Platform Support: We provide compatibility with leading test platforms, including Advantest, Teradyne, Cohu, Chroma, NI, KYEC, and YTEC, meeting diverse equipment setups and testing scenarios across different manufacturers.

3

Extensive High-Frequency and Fine-Pitch Design Experience: Completed multiple PCIe Gen5/6 and DDR5 validation projects, supporting fine-pitch probe designs for MEMS and advanced packaging.

4

On-Demand Support from Project Launch to Mass Production: Provide rapid technical assistance and flexible custom designs, helping IC design companies and OSATs address often-overlooked early-stage requirements, accelerate mass production introduced , and shorten lead times.

Types of iST Probe Cards

  • Cantilever Probe Card
  • Cantilever Probe Card
  • Vertical Probe Card
  • Supported Platforms
  • Target Application
  • Key Components of Load Board
  • Advantest: EXA, V93K, T2000, ND1~4
  • Teradyne: Ultraflex+, Ultraflex, J750, ETS
  • Cohu: Diamondx, D10, ASL
  • NI: STS
  • Chroma: 3360, 3350, 3380, 3680
  • KYEC: E320, I6000, I2K
  • YTEC: S50, S100, S300 For other inquiries, please contact us.
  • IC Design Companies: Verification of new projects, high-frequency testing for AI and HPC applications
  • Foundries (Wafer Manufacturers): Verification of WAT and E-test process parameters
  • OSAT (Outsourced Semiconductor Assembly and Test) Companies: Support wafer testing for mass production, optimize contact reliability and durability
  • IDM Companies: Support verification across various internal package types and high-reliability conditions
  • Automotive / High-Performance IC Manufacturers: Support high-power, high-temperature, and 3D packaging applications

A high-performance, stable probe card relies on the careful design of the following five key components. iST ensures their performance and longevity through rigorous verification processes:

ComponentDesign FocusiST Approach
NeedleGeometry and material directly affect contact stability and mark controlSelect optimal probe type based on DUT characteristics, e.g., cantilever or vertical, alloy or low-resistance, pointed or flat-tip
PCBSignal transmission stability, crosstalk suppressionHigh-speed routing design with SI/PI simulation verification
InterposerPitch conversion and structural supportCustom WST, MLC, MLO interposer layers to accommodate various package types
Active ComponentsOptimize signal and power integrityEmbed R/C components and optimize matching through simulation and measurement
StiffenerVibration damping and overall alignment precisionUse low thermal expansion materials to enhance test stability

Contact Window | Ms. Lin/Aaliyah | Tel:+886-3-5799909#8890 | Email:HWBU_Sales@istgroup.com

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