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Services
Tech Library
About iST
Press Room
- Press Releases
- Media Report
Investors
Careers
Contact Us
- Office Locations
- Contact Windows
Language
Search

Home Production Die Sawing

Die Sawing

Mass Production Service

MOSFET Wafer Backend Process

MOSFET Front-Side Metallization Process

Chemical / Electro-less Plating
Front-Side Metal Sputtering Deposition

MOSFET Backside Grinding Process

Wafer Thinning / Non-Taiko Grinding/Conventional Grinding (BGBM)

MOSFET Backside Metallization Process

Metal Evaporation Deposition for Backside Metallization
Thick Ag Process

Turnkey Solution for Backend Process

Chip Probing
Laser Marking
Vacuum Mounting
Ring Removal
Die Sawing
Frame Probing
Tape / Reel

Verification Analysis

FIB Circuit Edit

FIB Introduction and Application

FIB Circuit Edit/ CAD Probe Pad Debug
The Innovative FIB Circuit Edit (N-FIB)
G2 WLCSP circuit edit solution

Engineering Sample Preparation

Quick Assembly

Wafer Dicing Saw
Die Bonding
IC Wire Bonding / Assembly

Surface Mount Technique (SMT)

Surface Mount Technique (SMT)

Failure Analysis

Electrical Characteristics Measurement

I-V Curve Measurement
Auto Curve Tracer (ACT)
Nano Prober
Probe Measurement
TLP measurement of ESD Protection Devices

Non-Destructive Analysis

3D OM
SAT
X-ray Inspection (2D X-ray)
High Resolution 3D X-ray Microscope
Scanning Acoustic Tomography (SAT)

Sample Preparation

IC Decapsulation
IC Delayer
Cross-section & Backside polish
Ion Beam Cross-section Polisher (CP)

Defect Detection

Emission Microscope (EMMI)
InGaAs EMMI
Optical Beam Induced Resistance Change (OBIRCH)
Thermal EMMI (InSb)

Competitive Analysis

IC structure/ Competitive Analysis

Signal Integrity

Connectivity Signal Integrity Test

HDMI Test / Debug / Certification
HDCP Test ／Debug／Certification
Display Port Test／Debug／Certification
VESA DisplayHDR /
DisplayHDR True Black
Pre-test / Debug / Certification
Special Cable Signal Test
USB Type-C Test / Debug / Certification

Design Quality Management (DQM)

Compatibility Test
Software Maturity Test

Material Analysis

Sample Preparation

Dual Beam FIB

Structure Observation

Scanning Electron Microscope (SEM)
Transmission Electron Microscopy(TEM)
Dual Beam FIB
Plasma FIB

Surface Analysis

Auger Electron Spectroscopy (AES)
XPS/ESCA
Secondary Ion Mass Spectrometer (SIMS)
X-ray diffraction (XRD)
Atomic Force Microscopy (AFM)
White light interferometry (WLI)
Fourier Transform Infrared Spectroscopy (FTIR)

Thermal Analysis

Dynamic Mechanical Analyzer (DMA)
Differential Scanning Calorimeter (DSC)
Thermogravimetric Analyzer (TGA)
Thermomechanical Analyzer (TMA)

Component Analysis

Scanning Electron Microscope (SEM)
Transmission Electron Microscopy(TEM)
Auger Electron Spectroscopy (AES)
XPS/ESCA

Reliability Test

Component Reliability Test

Accelerated Environmental Stress Test

MSL Test
Temperature and Humidity test

Accelerated Lifetime Simulation Test

Operating Life Test (OLT)
Non-volatile Memory Reliability

Package Assembly Integrity Test

Wire Bonding Integrity
Solder Ball Integrity
Package Lead Integrity Test
Package Assembly Integrity Test

Electrical Verification Test

ESD/ EOS / Latch-up Verification
Low Voltage Surge Test
EMC Verification (EMI+EMS)
Conductive Atomic Force Microscopy (C-AFM)

Mechanical stress test

Board Level Reliability Test

Low Strain Rate Test

Thermal Cycling /Shock Test
Monotonic Bending / Cyclic Bending Test

High Strain Rate Test

Mechanical Shock Test
Vibration Test

Steady-State Test
Mechanical Stress tests
BLR Integrated Failure Analysis

PCB Design Verification

PCB Design and Fabrication Service
PCB Reliability Test

SMT Services

Surface Mount Technique (SMT)

Automotive Electronics Test

Reliability Test of Automotive IC (AEC-Q)
Automotive BLR verification
Automotive System/PCB Reliability Test

Warpage Verification

Warpage Measurement

Others

Accelerated Corrosion Verification Platform
PCB Pad Cratering Verification
Trace weight measurement and analysis
Packaged Devices Weight Loss/Gain Analysis

Chemical Analysis

Consultancy for green and environmental protection regulations

Chemical Substance Management

Precise and quantitative analysis and unknown substance analysis

Verification of PCB/ PCBA Chemicals
Oil/ Water/ Soil/ Gaseous pollutant Analysis
Micro Pollution (Unknown Material) Test/ Analysis

Various Consultancy

Quality assurance and function safety consultancy

Total Quality Management Consultancy (IATF 16949)
ISO 26262 Consultancy

ESG consultancy

Value-Added Services for HSE and ESG
Greenhouse Gas/Carbon and Water Footprint Assessment /ISO 50001 Consultancy

Laboratory accreditation and Green Mark consultancy

ISO/IEC 17025 Lab Certification Consultancy
WEEE Environment Protection Logo and EPEAT Consultancy

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