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Burn-in Board

What is a Burn-in Board, and at which stage of the manufacturing process is it applied?

A probe card is a critical interface tool used during the wafer test (Wafer Sort Test /Chip Probing) stage of semiconductor production. Before the ICs are diced and packaged, precise electrical testing is performed to ensure they meet mass production quality. By using a probe card, each die on the wafer can be accurately connected to the automated test equipment (ATE) for electrical verification. This process effectively screens out defective chips early, stabilizes and streamlines the testing workflow, and ultimately improves packaging efficiency and overall production yield.

This article will introduce the functions, types, applications, and advantages of Burn-in Boards.

  • What can iST do for you

    iST offers a turnkey solution for Burn-in Board (BIB) design and manufacturing services. The process covers circuit planning, simulation, material selection, board fabrication, and final verification, fully supporting customers in building high-efficiency and highly stable Burn-in test platforms.

    • Circuit Design and Architecture Planning
      Designing stable and scalable Burn-in circuit architectures based on the characteristics of the DUT and testing requirements.
    • Electrical Simulation and Analysis (SI/PI)
      Conducting signal integrity (SI) and power integrity (PI) simulations to ensure stability and accuracy under high-frequency and high-power conditions.
    • Mechanical and Thermal Design Simulation
      Analyzing socket structure and airflow distribution to prevent thermal stress caused by expansion and contraction, while enhancing thermal efficiency and overall reliability.
    • PCB Layout Design
      Performing multi-layer and high-density layout design based on simulation results, optimizing signal routing and thermal dissipation efficiency.
    • Board and Socket Fabrication
      Utilizing high-reliability materials and rigorous manufacturing processes, with support for various Burn-in socket styles and configurations.
    • Socket Contact Pre-test
      Using a dummy IC and test board, we verify socket continuity and contact quality before the customer’s IC arrives to ensure smooth burn-in testing and reliable fixture assembly.
    • Assembly and quality Validation
      Providing comprehensive SMT services for burn-in board assembly. We also offer flying probe testing to ensure the assembly quality and reliability of the burn-in boards.

iST’s Competitive Edge in Burn-in Board Design

1

From Simulation to Execution
Integrated design, analysis, manufacturing, and validation services help shorten development cycles.

2

Electrical / Thermal / Mechanical Integration
Enhance overall system-level reliability and test stability.

3

Extensive Industry Experience
Trusted by global leaders across AI, automotive, communication, and server applications.

4

In-House Burn-in Test Platform
Internal platforms available for real-world Burn-in validation, accelerating implementation efficiency.

iST In-house Burn-in Board & Daughter Board

  • Burn-in Board
  • Daughter Board
  • Application Scope
  • Burn-in testing for automotive chips
  • Reliability and lifetime verification for AI accelerators
  • High-temperature lifetime testing for server and communication components
  • Early failure screening for industrial ASICs

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