Burn-in Board

iST offers a turnkey solution for Burn-in Board (BIB) design and manufacturing services. The process covers circuit planning, simulation, material selection, board fabrication, and final verification, fully supporting customers in building high-efficiency and highly stable Burn-in test platforms.

• Circuit Design and Architecture Planning
  Designing stable and scalable Burn-in circuit architectures based on the characteristics of the DUT and testing requirements.
• Electrical Simulation and Analysis (SI/PI)
  Conducting signal integrity (SI) and power integrity (PI) simulations to ensure stability and accuracy under high-frequency and high-power conditions.
• Mechanical and Thermal Design Simulation
  Analyzing socket structure and airflow distribution to prevent thermal stress caused by expansion and contraction, while enhancing thermal efficiency and overall reliability.
• PCB Layout Design
  Performing multi-layer and high-density layout design based on simulation results, optimizing signal routing and thermal dissipation efficiency.
• Board and Socket Fabrication
  Utilizing high-reliability materials and rigorous manufacturing processes, with support for various Burn-in socket styles and configurations.
• Socket Contact Pre-test
  Using a dummy IC and test board, we verify socket continuity and contact quality before the customer’s IC arrives to ensure smooth burn-in testing and reliable fixture assembly.
• Assembly and quality Validation
  Providing comprehensive SMT services for burn-in board assembly. We also offer flying probe testing to ensure the assembly quality and reliability of the burn-in boards.