Device manufacturers often find it hard to determine whether customer’s complaints on IC packaging are caused by poor soldering process at the finished goods assembly or poor quality of BGA solder ball. Therefore, it is good to run a solder ball test over BGA/WLCSP packaged ICs before shipment to verify the solderability of solder balls.
3D OM image of BGA solder non-wetting
X-Ray image of BGA solder non-wetting
The Superiority of iST
iST now offers printed circuit plates of various sizes for the BGA solderability tests together with provision of different carrier plates or ceramic plates to deliver optimal services to minimize nuisances in test material preparation.
- IPC J-STD-002