Maximizing Electronics Reliability Through Burn-in Testing

Burn-in testing, often abbreviated as BI (Burn-in), is a key aspect of Accelerated Reliability Testing. It focuses on assessing the Early Life Failure Rate (ELFR) of electronic components by exposing them to excessive temperature and voltage conditions to induce early failures. This proactive quality assurance method accelerates the functional life of components, revealing hidden faults that could lead to early-phase failures. The failure rate in the Early Failure section is typically assessed using the Defect Parts Per Million (DPPM) metric.

Another essential aspect of burn-in testing is High Temperature Operating Life (HTOL) testing, which evaluates the operating lifespan of components. This assessment is indicated by metrics such as Failure In Time (FIT) or Mean Time To Failure (MTTF). Additionally, there are various test methods and conditions tailored to different product categories, such as High Temperature Gate Bias (HTGB), High Temperature Reverse Bias (HTRG), Bias Life Test and Intermittent Operation Life (IOL)

In burn-in testing, alterations of Acceleration Factors (such as voltage and temperature) are applied to the samples to simulate aging effects. The test results are then used to calculate failure rates, FIT, and MTTF. Overall, burn-in testing plays a crucial role in ensuring the reliability and longevity of electronic components by identifying potential failure modes early in the product lifecycle.

Reference Specification

• JESD 47
• JESD 74
• JESD22-A101
• JESD22-A110
• JESD22-A108

Stage 1: Preparation

Preparation begins with component selection and test parameter specification to ensure component dependability. It involves selecting the device under test (DUT) based on its sensitivity to early failure modes, including manufacturing defects or material discrepancies. Test parameters for integrated circuits and discrete products are set according to industry standards, including temperature ranges, voltage levels, and operating modes.

Stage 2: Execution

The chosen components undergo burn-in testing in controlled environments designed to simulate extreme operational stress. Devices Under Test (DUTs) endure preset temperature extremes and electrical stress, in compliance with industry standards. Electrical loads, including static or dynamic biases, are applied, with dynamic tests cycling power to mimic real-world conditions. This accelerated aging process helps reveal latent flaws and potential failure mechanisms.

To address the heat dissipation issues associated with AI chips for servers and high-performance computing (HPC), iST’s Reliability Lab employs advanced thermal management technologies. These include liquid cooling systems paired with custom liquid circulation sockets, which enable real-time monitoring of the chip’s temperature and adjustment of the liquid flow rate to stably control the heat generated by ultra-high-power AI chips. This maintains the integrity of the test environment.

Additionally, iST’s Reliability Lab adopts a new design concept for Burn-in Modules (BIM). Instead of testing multiple chips on a single board to focusing on testing only one chip. This approach allows for individualized test parameter settings based on the different static leakage currents of each chip’s transistors, further enhancing the testing quality of AI chips.

Stage 3: Analysis

After the burn-in test, the results are analyzed to determine component reliability. Empirical methods are used to assess failure rates and trends, revealing systemic issues or defect-specific concerns. Engineers can identify early failures and random wear-out mechanisms by plotting the findings against the predicted reliability bathtub curve. Components that successfully pass the burn-in process are considered reliable throughout their expected lifespan.

Failed parts undergo a comprehensive root cause analysis to identify failure mechanisms. This processstrengthens manufacturing processes and component design,informing decisions on material selection, component architecture, and fabrication methods, ultimately reducing failure rates and enhancing electronic system reliability.

Static Burn-in Test

The Static Burn-in Test puts electronic components at high temperatures and voltages without altering them or applying different input signals. It aims to detect defects related to thermal and electrical stress endurance, including dielectric breakdown, electromigration, and stress-induced leakage currents.

Static burn-in works better on discrete semiconductor devices and smaller integrated circuits with non-operational failure mechanisms. It screens capacitors and resistors for material or manufacturing defects that could trigger early failure.

Dynamic Burn-in Test

Dynamic Burn-in Test simulates operational conditions by manipulating input signals while introducing thermal and electrical stressors. This method uncovers a wider range of failure mechanisms, including timing faults of microprocessor logic or memory chip, which are not detectable under static conditions.

By mimicking real-world scenarios, dynamic tests reveal hidden flaws. Operating temperatures are adjusted based on device tolerance levels. CPUs, GPUs, and ASICs are especially well-suited for Dynamic Burn-in Tests due to their complexity and susceptibility to thermal stress.

1. Enhance product reliability by detecting early failures and preventing premature failure.
2. Reduce the risk of field failures and associated costs, ensuring compliance with industry standards.
3. Enhance customer satisfaction and trust by improving product quality and reliability.
4. Detect manufacturing flaws and material issues early, supporting continuous improvement.
5. Provide statistical process control, enabling accurate lifetime prediction and warranty assessments, while optimizing thermal management.