SIPI simulation might be what you’re Missing! If you’re facing repeating compliance failures, or mass production issues, the solution may not be “more testing”…It may be earlier SIPI-driven design thinking…
R&D engineers often face a challenge: the IC Substrate samples quantity is too small, major manufacturers unwilling to accept the order…
Engineers tired of QFN FT sockets wearing out after 20K cycles? iST’s Rubber Socket (PCR) lasts up to 150K cycles even at 125°C. Ensure stable conduction, reduce maintenance, and boost testing efficiency with iST’s proven QFN FT solution.
HAST PCB Fail ? Sometimes the HAST fails not because of the IC, but the PCB! We offer recommendations to avoid costly detours…
When light is integrated into the chip, the game rules are completely different. iST’s SiPh verification covers the full spectrum…
TGV Failure Analysis real case sharing. TGV becomes a new option for advanced packaging, how to identify the root causes?