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Tech Library

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3 Steps to identify the causes of 3D-IC failures

The 3D chip stacking technology for improved electronic product performance comes with its own problems, it’s much harder to pinpoint defects encountered…

Goodbye black & white, SCM easily determines P/N type with colors

For best P/N identification, it is recommended to obtain its width and depth based on a clear SEM image and identify the position with colors by SCM…

Ideal cross section analysis tool for structural inspection of sizes greater than 100um

Plasma FIB enables large scope observation to present the whole structure in the target area at etching speeds 20 folds faster than traditional DB FIB…

How to Pinpoint the Defect in MEMS Component?

A smart device screen fails to turn: is it a device failure or a component defect?If it’s a MEMS component defect: is it a leak, obstruction, or off-set? Most importantly, how do you pinpoint the cause?As a smartphone developer or MEMS components designer…

What 3D X-ray upgrade can do for you?

iST has upgraded its equipment stock with a ZEISS Xradia 520 Versa, a cutting-edge High Resolution 3D X-ray Microscope, for industry leading resolution…

Thermal EMMI (InSb) – Easy spotting of defects without de-capsulation, applicable to 3D packaged products.

iST has heard your needs and introduced Thermal EMMI (InSb) for detecting defects without de-capsulation of IC., including a low-resistance (<10ohm)...