How to find suspected defects from complicated MCP/SiP structure? How to isolate interference from other chips/dies and get correct testing results?

Have you ever wondered why your product ended up with contradicting result after ESD test by different labs? Or, shocked when two latch-up tests on the same product failed and passed respectively….

How to quickly pinpoint defects of a FCQFN with failure analysis tools? We will show you how to pinpoint the defect position with iST‘s five steps…

What to do when SEM can’t distinguish substances of samples by layers? No defects found with SEM even the defected ICs have been delayered? SEM BSE helps…

Advanced packaging and heterogeneous integration is hot today. That’s the case with the quality of solder balls as well. How to identify solder ball defects quickly?

“TIM(Thermal Interface Materials)” has been the key to the useful life of high-power advanced packaging products which, in turn, is determined by its…