How to find suspected defects from complicated MCP/SiP structure? How to isolate interference from other chips/dies and get correct testing results?
As an extension of grinding delayer, PFIB can perform large area and excellent uniformity delayering of a specific area or layer through plasma etching with the manufacturer’s patented gas to fully present the target area of up to 200μm x 200μm …
Have you ever wondered why your product ended up with contradicting result after ESD test by different labs? Or, shocked when two latch-up tests on the same product failed and passed respectively….
How to package a small amount of chips for testing yet no assembling and testing houses would offer their help? See this article for quick FT Socket…
Lenovo and Intel have been advocating LTS process since 2017. Why is it coming into our focus now and why is it required?Will this LTS be the mainstream of consumer products in years to come?…
The LTS technology not only saves energy and cuts carbon emission but also reduces failures and defects when soldering electronic components at high temperature…