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Two Obstacles, Challenges and Solutions for Advanced Packaging in Automotive Reliability
2019-04-24

To keep up with the demand for high-speed transmission, automotive semiconductor chips are growingly packaged in MCM/SiP assembly, instead of BGA…

Key Points You Must Know About Automotive Electronics Verification
2018-10-30

Do you know what differentiates “industry spec” and “customer spec” in the automotive electronics industry? How to do tests at the smallest cost and…

Six Key points to Learn the AEC-Q104 for Automotive MCM in No Time
2018-04-10

Which standard, AEC-Q100 or ISO16750, should be employed for automotive tests by manufacturers of complex multichips like MCM and SIP? This year, problems that baffled IC design houses…

Tier 1 auto makers focus—BLR and temperature/humidity combined vibration test
2018-03-01

This article shall explore the BLR test and the most critical item in it – temperature/humidity combined vibration focused by leading Tier 1 car makers…