How to use analysis tools to verify the rheological characterization of materials underfill in heterogeneous component integration, as well as the strength of bonding strength of copper and dielectric materials…
Electrochemical migration ECM takes place easily to cause short circuit in HAST. Is it a flux issue or the test environment issue? How can we prevent ECM in HAST ?
When the board level reliability test fails and you are asked to debug,how to quickly find the location of advanced packaging joint defect in 3 steps?…
While process equipment is the key to semiconductor yield, how to improve advanced process defects through materials analysis?…
Do you know that PCB design is the key to pass or fail in broad level reliability tests?
How to interpret and use the values from HTOL and the resulting MTTF and Failure Rate (λ)? What are the differences between MTTF and MTBF?