Addressing zero defects, the first edition of AEC-Q004 guidelines has been released by AEC in 2020. This is a handbook aimed to supplement the specifications of AEC-Q100-104, and AEC-Q200…
iST reliability lab introduces a vacuum pressure oven, which can prevent the underfill voids from affecting the reliability test results…
Wafer Ultra thinning has been the most direct and effective process improvement in cutting power consumption and input impedance of power semiconductors which not only reduce packaging dimension but also…
Advanced packaging and heterogeneous integration is hot today. That’s the case with the quality of solder balls as well. How to identify solder ball defects quickly?
How to perform flip chip die bonding on substrate with AI pad only? How to prevent non-wetting or displacement when the copper pillar bump is replacing solder ball in the era of advanced packaging?…
Applying AI technology to the COVID-19 pandemic prevention is a hot topic now, how to apply AI in accurate pandemic prediction and prevention?