There are several methods to section a chip to solve structural issues.According to the attributes of your samples, which methodology is the best choice?…
How to perform flip chip die bonding on substrate with AI pad only? How to prevent non-wetting or displacement when the copper pillar bump is replacing solder ball in the era of advanced packaging?…
IC die bonding process is one of key steps in semiconductor’s packaging process and its quality is critical to the capacity of entire packaging process…