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How to Transform Existing Chips into Final Test Sockets
2022-01-05

How to package a small amount of chips for testing yet no assembling and testing houses would offer their help? See this article for quick FT Socket…

iST Latest Case Study in Die Bonding of Advanced Packaging
2020-10-22

How to perform flip chip die bonding on substrate with AI pad only? How to prevent non-wetting or displacement when the copper pillar bump is replacing solder ball in the era of advanced packaging?…

Automatic Die Bonding Technology: Ideal for Fast Engineering Sample Packaging
2019-11-11

IC die bonding process is one of key steps in semiconductor’s packaging process and its quality is critical to the capacity of entire packaging process…