Have you encountered inconsistencies or edge chipping with traditional wafer dicing machines when processing hard or brittle materials in semiconductor manufacturing?
There are several methods to section a chip to solve structural issues.According to the attributes of your samples, which methodology is the best choice?…
How to package a small amount of chips for testing yet no assembling and testing houses would offer their help? See this article for quick FT Socket…
How to perform flip chip die bonding on substrate with AI pad only? How to prevent non-wetting or displacement when the copper pillar bump is replacing solder ball in the era of advanced packaging?…
IC die bonding process is one of key steps in semiconductor’s packaging process and its quality is critical to the capacity of entire packaging process…