Failure Analysis Archives - iST-Integrated Service Technology

Failure Mechanism The issue is at the packaging and testing side; it’s not my concern. Why should I care?" This remains a common misconception among IC design engineers when faced with Board Level Reliability (BLR) failures, such as package delamination. While identifying liability is necessary, deeply analyzing the Failure Mechanism is the real key to winning customer trust. In the race toward Zero Defect, the ability to master precisely when and why a product fails—more accurately than the carmakers themselves—is the entry ticket to the global automotive supply chain.

2026-05-12by Hsinyi

Beyond AEC-Q: Why a “Pass” is No Longer Enough

Destructive Physical Analysis It’s a chipmaker’s worst nightmare: Your SoC has survived thousands of hours of reliability stress testing, and the ATE (Automatic Test Equipment) data is flawless. With a "Pass" in hand, the contract seems secure. However, the shock comes during the Tier 1’s IQC (Incoming Quality Control). Despite perfect electrical signatures, the entire batch is rejected due to microscopic solder joint cracks. In an instant, months of R&D effort are wasted, and the Design Win you fought for is in jeopardy. This raises a critical question: If your electrical data is perfect but the structure is failing, how can you truly guarantee Zero Defect?

2026-03-25by Hsinyi

The False Pass Crisis: Why Flawless ATE Data Can Still Lead to Tier 1 Rejections?

TGV Failure Analysis

2025-09-09by Hsinyi

Glass Substrate vs. Silicon Substrate: Unveiling the True Cause of TGV Product Failures

SRAM Failure Analysis Investigating the Root Causes of SRAM Failures in AI Applications

2024-08-01by ruby

Investigating the Root Causes of SRAM Failures in AI Applications

Semi-Automated Grinding Polishing

2024-05-07by ruby

Semi-Automated Grinding Polishing Successfully Thin Silicon Substrate to Easily Identify Anomalies

C-AFM defect

2024-01-16by ruby

C-AFM Precisely Identifies Defects in High-Level Chips

2023-12-05by ruby

iST's Exclusive Technique Efficiently Detects Hot Spots in GaN Chips

CIS Chip defect

2023-02-07by ruby

Where to seek help for CIS chip defects

2022-11-22by ruby

Methods of precise positioning for defect detection based on nanoscale electrical characteristics measurement

2022-08-30by ruby

Among four major sectioning methodologies, which one is best for your sample?