The International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) has always been a premier international event for semiconductor failure analysis and reliability. This year, the experts from iST also traveled to Singapore to participate in this prestigious event…
iST will be participating as an exhibitor in the upcoming TSMC 2024 Japan Technology Symposium on June 30 at the Yokohama Bay Hotel Tokyu.
iST had an incredible time showcasing our cutting-edge electronic packaging solutions at the International Conference on Electronic Packaging (ICEP), Japan's largest electronic packaging technology conference, from April 17th to 20th, 2024…
iST is delighted to attend the IEEE International Reliability Physics Symposium (IRPS) from April 16th to 18th, 2024. During this three-day exhibition…
EPTC Conference, the pinnacle of advanced IC packaging technology in Asia, will hold its 25th edition from December 5th to December 8th, 2023, in Singapore.Additionally, iST will have a Panel booth at EPTC, and we welcome you to join us for discussions…
iST will be participating as an exhibitor in the upcoming TSMC 2023 JP OIP on October 24 at the Grand Hyatt Tokyo….
iST will be participating as an exhibitor in the upcoming TSMC 2023 NA OIP on September 27 at the Santa Clara Convention Center.
iST will be participating as an exhibitor in the upcoming TSMC 2023 Japan Technology Symposium on June 30 at the Yokohama Bay Hotel Tokyu.
We look forward to having industry professionals share their expertise, allowing students to gain a better understanding of the industry ecosystem, bridging the gap between theory and practice. They also inspire them to explore more possibilities for their future career paths…