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Why Do Two ESD Tests End up Having Such Different Results?

Have you ever wondered why your product ended up with contradicting result after ESD test by different labs? Or, shocked when two latch-up tests on the same product failed and passed respectively….

How to Transform Existing Chips into Final Test Sockets

How to package a small amount of chips for testing yet no assembling and testing houses would offer their help? See this article for quick FT Socket…

Will LTS Process be the Mainstream in the Future?

Lenovo and Intel have been advocating LTS process since 2017. Why is it coming into our focus now and why is it required?Will this LTS be the mainstream of consumer products in years to come?…

Marching Toward Carbon Neutrality via Low Temperature Soldering (LTS)

The LTS technology not only saves energy and cuts carbon emission but also reduces failures and defects when soldering electronic components at high temperature…

How to Find the Defects of a Flip Chip QFN

How to quickly pinpoint defects of a FCQFN with failure analysis tools? We will show you how to pinpoint the defect position with iST‘s five steps…

What does BLR mean for IC Design Engineers?

Are there any means to prevent PCB assembled with flawless IC chip from failing because of poor soldering? BLR aimed to make IC component fit its app…