To identify failure of the single component which results in defective IC is a tall order. Internal wiring and board circuit connections among SiP, MCM, MCP, and QFP tends to suffer in electric tests by interference of other chips or device components which, in turn, makes test results hard or even impossible clear…

3D X-ray are also ideal for non-destructive inspection over 3D IC, MEMS, and even PCB, PCBA, lithium battery/engineering Plastics…

Many customers would like to know further about the thickness limit of wafer thinning, and the procedure of MOSFET wafer thinning, the present demand…

To keep up with the demand for high-speed transmission, automotive semiconductor chips are growingly packaged in MCM/SiP assembly, instead of BGA…

Since 2018, iST officially entered into the wafer thinning process service, which is a critical process between the wafer mass production and packaging…

As predicted by Moore’s Law, the IC process is continuously shrinking down to below 16 nm, as most of ICs package types are flip chip packages, backside…