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Four Key Applications of Nanoindentation and Scratch Testing for Advanced Packaging
2023-10-17

Thin film adhesion hardness is key to addressing the challenge of diverse material properties in advanced packaging technology. We rely on…

Lower-Cost TEM Unlocks Atomic-Scale Heterogeneous Crystal Interfaces
2023-09-21

This article presents the use of FFT (Fourier filtering techniques) to enhance HRTEM image quality in TEM at a relatively lower cost…

Decoding Thermal Characteristics in Advanced Packaging Materials
2023-09-12

Thermal Analysis is an important way to understand the crucial thermal characteristics of advanced packaging materials. We’ll disclosure….

VESA Introduces ClearMR Certification to Redefine Gaming Monitor Motion Display Specifications
2023-08-08

How does VESA ClearMR certification define the blur ratio of dynamic images? And what are the key testing points involved?

Five Case Studies Unveil What You Don’t Know About TEM Material Analysis
2023-07-27

TEM DF, the useful feature of TEM. How to select at least 8 types of TEM image analysis techniques to achieve efficient & effective material analysis?

How to Choose the Next Generation of Wide Bandgap Semiconductor Materials Beyond GaN and SiC
2023-07-11

When Si can’t meet the demands of high-speed transmission & high voltage, it’s imperative to find the best wide bandgap material to replace…